Effect of stress triaxiality on damage evolution of porous solder joints in IGBT Discretes
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DOI: 10.1016/j.jmapro.2018.01.025
Abstract: Abstract In this paper, the effect of stress states on the damage behavior of Sn-based solder connection in an IGBT discrete during thermal cycling (−40 °C to 160 °C) was investigated. To achieve the accurate results in… read more here.
Keywords: triaxiality; effect stress; solder; stress triaxiality ... See more keywords