Articles with "post cmp" as a keyword



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Synergistic effect of composite complex agent on BTA removal in post CMP cleaning of copper interconnection

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Published in 2020 at "Materials Chemistry and Physics"

DOI: 10.1016/j.matchemphys.2020.123230

Abstract: Abstract Benzotriazole (BTA) is a common corrosion inhibitor for chemical mechanical polishing (CMP) of multilayer copper wiring of integrated circuit. It is also the main object to be removed in post CMP cleaning. In this… read more here.

Keywords: agent; microscopy; copper; post cmp ... See more keywords
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Environmental Effects on Post-CMP PVAc Brush Releasable Contamination and Break-In Optimization for Advanced Logic and Memory Technologies

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Published in 2019 at "ECS Journal of Solid State Science and Technology"

DOI: 10.1149/2.0161912jss

Abstract: Advanced sub-7nm logic and VNAND memory technologies are becoming more reliant on Chemical Mechanical Planarization (CMP). New layers and materials are being introduced with each new technology node and integration scheme. Polyvinyl-acetal (PVAc) brushes are… read more here.

Keywords: releasable contamination; pvac brush; post cmp; break ... See more keywords