Synergistic effect of composite complex agent on BTA removal in post CMP cleaning of copper interconnection
Sign Up to like & getrecommendations! Published in 2020 at "Materials Chemistry and Physics"
DOI: 10.1016/j.matchemphys.2020.123230
Abstract: Abstract Benzotriazole (BTA) is a common corrosion inhibitor for chemical mechanical polishing (CMP) of multilayer copper wiring of integrated circuit. It is also the main object to be removed in post CMP cleaning. In this… read more here.
Keywords: agent; microscopy; copper; post cmp ... See more keywords
Cobalt interconnect integration: progress in metal deposition, chemical mechanical polishing, and post-CMP cleaning for advanced technology nodes
Sign Up to like & getrecommendations! Published in 2025 at "Journal of Materials Chemistry C"
DOI: 10.1039/d5tc02573g
Abstract: This review systematically analyzes the deposition, chemical mechanical planarization (CMP), and post-CMP cleaning (PCMPC) processes for cobalt interconnect structures in advanced technology nodes of integrated circuits. read more here.
Keywords: cmp; chemical mechanical; cmp cleaning; post cmp ... See more keywords
Environmental Effects on Post-CMP PVAc Brush Releasable Contamination and Break-In Optimization for Advanced Logic and Memory Technologies
Sign Up to like & getrecommendations! Published in 2019 at "ECS Journal of Solid State Science and Technology"
DOI: 10.1149/2.0161912jss
Abstract: Advanced sub-7nm logic and VNAND memory technologies are becoming more reliant on Chemical Mechanical Planarization (CMP). New layers and materials are being introduced with each new technology node and integration scheme. Polyvinyl-acetal (PVAc) brushes are… read more here.
Keywords: releasable contamination; pvac brush; post cmp; break ... See more keywords