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Published in 2020 at "Materials Science in Semiconductor Processing"
DOI: 10.1016/j.mssp.2019.104883
Abstract: Abstract The chemical mechanical polishing (CMP) of Cu/Co/TaN barrier liner stack of the sub-14nm devices was associated with several challenges, one of which was to screen out the desired slurries formulation. In this paper, the…
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Keywords:
tan barrier;
barrier;
mechanical polishing;
potassium tartrate ... See more keywords