Design, Integration and Performance Analysis of a Lid-Integral Microchannel Cooling Module for High-Power Chip
Sign Up to like & getrecommendations! Published in 2021 at "Applied Thermal Engineering"
DOI: 10.1016/j.applthermaleng.2021.117457
Abstract: Abstract In this paper, a lid-integral silicon-based microchannel cooling module (LSMCM) for a large-sized and high-power chip was designed, fabricated, and experimentally evaluated. The silicon-based microchannel heat sink was directly attached to a thermal test… read more here.
Keywords: high power; heat; power chip; chip ... See more keywords
Implementation and Switching Behavior of a PCB-DBC IGBT Module Based on the Power Chip-on-Chip 3-D Concept
Sign Up to like & getrecommendations! Published in 2017 at "IEEE Transactions on Industry Applications"
DOI: 10.1109/tia.2016.2604379
Abstract: With the emergence of new power semiconductor devices, the switching speeds in power converters are increasing. The stray inductances of switching cells must, therefore, be minimized to limit overvoltages on transistors. One relatively new approach,… read more here.
Keywords: module; implementation switching; power; chip chip ... See more keywords
Fast SPICE-Compatible Simulation of Low-Power On-Chip PWM DC–DC Converters With Improved Ripple Accuracy
Sign Up to like & getrecommendations! Published in 2020 at "IEEE Transactions on Power Electronics"
DOI: 10.1109/tpel.2019.2961211
Abstract: The circuit averaging technique has long been used as the basis for modeling the behavioral effects of switched-mode pulsewidth-modulated (PWM) dc–dc power converter circuits due to its simplicity and efficiency in simulation. However, circuit-averaged models… read more here.
Keywords: chip pwm; power chip; power; low power ... See more keywords