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Published in 2018 at "IEEE Transactions on Electromagnetic Compatibility"
DOI: 10.1109/temc.2017.2725270
Abstract: Supply fluctuation is one of the most significant factors that cause jitter in high-speed I/O links. The traditional SPICE simulation or measuring method for power supply induced jitter is quite time-consuming and draining on resources.…
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Keywords:
jitter;
power ground;
induced power;
based ibis ... See more keywords
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Published in 2020 at "IEEE Transactions on Microwave Theory and Techniques"
DOI: 10.1109/tmtt.2020.3022009
Abstract: In this article, we propose a double-sided electromagnetic bandgap (DS-EBG) structure for glass interposers (GIs) with low substrate loss to suppress power/ground noise. For the first time, we validated wideband power/ground noise suppression in the…
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Keywords:
power;
power ground;
structure;
ground noise ... See more keywords
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Published in 2022 at "Micromachines"
DOI: 10.3390/mi13091433
Abstract: In this study, power/ground noise suppression structures were designed based on a proposed dispersion analysis for packages and interposers with low-loss substrates. Low-loss substrates are suitable for maintaining signal integrity (SI) of high-speed channels operating…
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Keywords:
noise suppression;
power ground;
power;
ground noise ... See more keywords