Thermomechanical properties and fatigue life evaluation of SnAgCu solder joints for microelectronic power module application
Sign Up to like & getrecommendations! Published in 2020 at "Journal of materials research and technology"
DOI: 10.1016/j.jmrt.2020.03.078
Abstract: Abstract In this paper, a new constitutive model of SnAgCu lead-free solder, which covered the low-temperature and elevated-temperature creep properties, was constructed according to the thermomechanical property test under a wide range of temperatures (−40… read more here.
Keywords: power module; microelectronic power; power; model ... See more keywords
Interference source analysis and EMC design for All-SiC power module in EV charger
Sign Up to like & getrecommendations! Published in 2019 at "Microelectronics Reliability"
DOI: 10.1016/j.microrel.2019.113458
Abstract: Abstract Silicon carbide (SiC) power devices suitable for high-frequency, high-power density and high-temperature applications, and thus gain a broad prospect in the electric vehicle (EV) charger area. However, the high-frequency switching of SiC devices under… read more here.
Keywords: power module; charger; power; emc ... See more keywords
Design of a 2.4 kV Half‐Bridge Power Module With Chip‐Level Series‐Connected SiC MOSFETs
Sign Up to like & getrecommendations! Published in 2025 at "IET Power Electronics"
DOI: 10.1049/pel2.70048
Abstract: Series connection of silicon carbide (SiC) metal‐oxide–semiconductor field effect transistors (MOSFETs) is a viable solution to reach blocking voltages that are not yet commercially available or limited for single‐chip devices. Typically, serialization is realized with… read more here.
Keywords: series connected; series; chip; power module ... See more keywords
A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues
Sign Up to like & getrecommendations! Published in 2020 at "IEEE Journal of Emerging and Selected Topics in Power Electronics"
DOI: 10.1109/jestpe.2019.2951801
Abstract: Power module packaging technologies have been experiencing extensive changes as the novel silicon carbide (SiC) power devices with superior performance become commercially available. This article presents an overview of power module packaging technologies in this… read more here.
Keywords: module packaging; packaging technologies; power module; packaging ... See more keywords
Investigation of Low-Profile, High-Performance 62-mm SiC Power Module Package
Sign Up to like & getrecommendations! Published in 2021 at "IEEE Journal of Emerging and Selected Topics in Power Electronics"
DOI: 10.1109/jestpe.2020.2971623
Abstract: Silicon carbide (SiC) power devices possess many beneficial properties for power electronics applications, but commercial 62-mm SiC power module packages with the direct drop-in replacement of Si devices limit many benefits of these SiC power… read more here.
Keywords: power module; low profile; module; power ... See more keywords
A 200 ∘C SiC Phase-Leg Power Module With Integrated Gate Drivers: Development, Performance Assessment, and Path Forward
Sign Up to like & getrecommendations! Published in 2025 at "IEEE Journal of Emerging and Selected Topics in Power Electronics"
DOI: 10.1109/jestpe.2025.3550869
Abstract: In order to reduce the size, weight, and cost of power electronic systems, a high-temperature silicon carbide (SiC)-based half-bridge power module is proposed in this article. Two gate drivers, which were fabricated on low-temperature co-fired… read more here.
Keywords: power module; tex math; power; inline formula ... See more keywords
Thermomechanical Stress Analysis, Characterization, and Optimization for Double-Side Cooled Power Modules With Ceramic Substrate
Sign Up to like & getrecommendations! Published in 2024 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2024.3381471
Abstract: Benefiting from the high thermal performance and low parasitic parameters, double-side cooled (DSC) power modules are promising in high-power-density applications. However, as the structure of DSC power module differs from that of conventional power module,… read more here.
Keywords: dsc power; power modules; ceramic substrate; power module ... See more keywords
Design and Fabrication of a Ceramic Substrate-Embedded SiC Power Module
Sign Up to like & getrecommendations! Published in 2025 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2025.3538658
Abstract: Embedded packaging of wide-bandgap (WBG) power modules offers an inherently lower parasitic inductance, higher switching frequency, and lower power losses compared to traditional wire-bonding technology. However, the present embedded technology suffers from a relatively tight… read more here.
Keywords: technology; process; module; power module ... See more keywords
Partial Discharge in Silicone Gel on Power Module Substrates in High-Humidity Conditions
Sign Up to like & getrecommendations! Published in 2025 at "IEEE Transactions on Dielectrics and Electrical Insulation"
DOI: 10.1109/tdei.2024.3404367
Abstract: Partial discharge (PD) is known to affect the quality of insulation in power electronics modules. This article provides a comprehensive characterization of PD activity in gel-encapsulated direct bonded copper (DBC) power module substrates when subjected… read more here.
Keywords: humidity; partial discharge; power module; high humidity ... See more keywords
Navigating Strategies to Mitigate Insulation Issues Within High Power Density (U)WBG Power Module Packages: A Comprehensive Review Emphasizing Alternative Encapsulation Materials
Sign Up to like & getrecommendations! Published in 2025 at "IEEE Transactions on Industry Applications"
DOI: 10.1109/tia.2024.3520096
Abstract: The future of packaging for power modules hinges on the advancement of (U)WBG) materials like SiC, AlN, and diamond. However, pushing these boundaries faces significant challenges in insulation systems, which must withstand the demanding parameters… read more here.
Keywords: encapsulation materials; insulation; wbg power; power module ... See more keywords
High-Temperature Partial Discharge Characteristics of Power Module Packaging Insulation Under Square Pulse With High Dv/Dt Based on Down-Mixing Method
Sign Up to like & getrecommendations! Published in 2023 at "IEEE Transactions on Industrial Electronics"
DOI: 10.1109/tie.2022.3201276
Abstract: Partial discharge (PD) in the high voltage packaging insulation under square pulse with a high slew rate (SR or dV/dt) is one of the main causes of the power module failure, especially for wide bandgap… read more here.
Keywords: temperature; power module; packaging insulation; square pulse ... See more keywords