Thermomechanical properties and fatigue life evaluation of SnAgCu solder joints for microelectronic power module application
Sign Up to like & getrecommendations! Published in 2020 at "Journal of materials research and technology"
DOI: 10.1016/j.jmrt.2020.03.078
Abstract: Abstract In this paper, a new constitutive model of SnAgCu lead-free solder, which covered the low-temperature and elevated-temperature creep properties, was constructed according to the thermomechanical property test under a wide range of temperatures (−40… read more here.
Keywords: power module; microelectronic power; power; model ... See more keywords
Interference source analysis and EMC design for All-SiC power module in EV charger
Sign Up to like & getrecommendations! Published in 2019 at "Microelectronics Reliability"
DOI: 10.1016/j.microrel.2019.113458
Abstract: Abstract Silicon carbide (SiC) power devices suitable for high-frequency, high-power density and high-temperature applications, and thus gain a broad prospect in the electric vehicle (EV) charger area. However, the high-frequency switching of SiC devices under… read more here.
Keywords: power module; charger; power; emc ... See more keywords
A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues
Sign Up to like & getrecommendations! Published in 2020 at "IEEE Journal of Emerging and Selected Topics in Power Electronics"
DOI: 10.1109/jestpe.2019.2951801
Abstract: Power module packaging technologies have been experiencing extensive changes as the novel silicon carbide (SiC) power devices with superior performance become commercially available. This article presents an overview of power module packaging technologies in this… read more here.
Keywords: module packaging; packaging technologies; power module; packaging ... See more keywords
Investigation of Low-Profile, High-Performance 62-mm SiC Power Module Package
Sign Up to like & getrecommendations! Published in 2021 at "IEEE Journal of Emerging and Selected Topics in Power Electronics"
DOI: 10.1109/jestpe.2020.2971623
Abstract: Silicon carbide (SiC) power devices possess many beneficial properties for power electronics applications, but commercial 62-mm SiC power module packages with the direct drop-in replacement of Si devices limit many benefits of these SiC power… read more here.
Keywords: power module; low profile; module; power ... See more keywords
High-Temperature Partial Discharge Characteristics of Power Module Packaging Insulation Under Square Pulse With High Dv/Dt Based on Down-Mixing Method
Sign Up to like & getrecommendations! Published in 2023 at "IEEE Transactions on Industrial Electronics"
DOI: 10.1109/tie.2022.3201276
Abstract: Partial discharge (PD) in the high voltage packaging insulation under square pulse with a high slew rate (SR or dV/dt) is one of the main causes of the power module failure, especially for wide bandgap… read more here.
Keywords: temperature; power module; packaging insulation; square pulse ... See more keywords
Flexible PCB-Based 3-D Integrated SiC Half-Bridge Power Module With Three-Sided Cooling Using Ultralow Inductive Hybrid Packaging Structure
Sign Up to like & getrecommendations! Published in 2019 at "IEEE Transactions on Power Electronics"
DOI: 10.1109/tpel.2018.2866404
Abstract: Silicon carbide (SiC) devices are capable of high switching speeds and also enable high switching frequency in power electronic converters. However, this feature poses substantial challenges to packaging, especially limiting the loop inductance. The traditional… read more here.
Keywords: hybrid packaging; packaging structure; power module; power ... See more keywords
PowerSynth: A Power Module Layout Generation Tool
Sign Up to like & getrecommendations! Published in 2019 at "IEEE Transactions on Power Electronics"
DOI: 10.1109/tpel.2018.2870346
Abstract: PowerSynth is a multiobjective optimization tool for rapid design and verification of power semiconductor modules. By using reduced order models for the calculation of electrical parasitics of the layout and thermal coupling between devices, optimal… read more here.
Keywords: module layout; power module; power; tool ... See more keywords
Power Density Optimization of 700 kHz GaN-Based Auxiliary Power Module for Electric Vehicles
Sign Up to like & getrecommendations! Published in 2021 at "IEEE Transactions on Power Electronics"
DOI: 10.1109/tpel.2020.3026328
Abstract: This article proposes a high-power density 1.8 kW auxiliary power module (APM) for electric vehicles (EVs) based on gallium nitride devices. A design procedure for the high-frequency phase-shift full-bridge with current-doubler rectifier using printed circuit… read more here.
Keywords: power module; power density; auxiliary power; electric vehicles ... See more keywords
In Situ Full-Field Deformation Characterization of Power Module and FEA Model Calibration Based on Stereo Digital Image Methodology
Sign Up to like & getrecommendations! Published in 2023 at "IEEE Transactions on Power Electronics"
DOI: 10.1109/tpel.2023.3265419
Abstract: Due to the increasing concern for the global climate problem, the electric vehicle has drawn considerable attention. The power module with high reliability is the key to the deployment and development of the electric vehicle.… read more here.
Keywords: deformation; methodology; power; power module ... See more keywords
Design, Construction, and Testing of an 80-kJ and 2.4-MJ/m3 Inductive Pulsed Power Module for Electromagnetic Launchers
Sign Up to like & getrecommendations! Published in 2020 at "IEEE Transactions on Plasma Science"
DOI: 10.1109/tps.2019.2958610
Abstract: Inductive pulsed power supplies have become a promising option for the power supplies of electromagnetic launchers, because they can reach a good balance between the energy storage density and the power density. This article presents… read more here.
Keywords: inductive pulsed; power module; pulsed power; electromagnetic launchers ... See more keywords