High-temperature electro-ceramics and their application to SiC power modules
Sign Up to like & getrecommendations! Published in 2018 at "Ceramics International"
DOI: 10.1016/j.ceramint.2017.11.140
Abstract: Abstract This paper presents the research achievement in Japan to develop highly-refractive electro-ceramics for application to silicon carbide (SiC) power modules such as heat-resistive passive components (snubber capacitors and resistors), metalised substrates, ceramic circuit boards,… read more here.
Keywords: temperature; power modules; electro ceramics; sic power ... See more keywords
A methodology to determine reliability issues in automotive SiC power modules combining 1D and 3D thermal simulations under driving cycle profiles
Sign Up to like & getrecommendations! Published in 2019 at "Microelectronics Reliability"
DOI: 10.1016/j.microrel.2019.113500
Abstract: Abstract Current environmental concerns and fuel scarcity are leading to the progressive introduction of Electric Vehicles (EV) in the global fleet vehicle population. This requires significant design and research efforts from scientific community and industry… read more here.
Keywords: methodology; power; power modules; reliability ... See more keywords
A Review of Partial Discharge in Medium Voltage SiC Power Modules Under Square Wave Excitation: Characterization, Mitigation, and Detection
Sign Up to like & getrecommendations! Published in 2024 at "IEEE Journal of Emerging and Selected Topics in Power Electronics"
DOI: 10.1109/jestpe.2024.3408449
Abstract: The medium voltage (MV) silicon carbide (SiC) power modules hold significant promise as a route for the solid-state converters to achieve higher power density, higher switching frequency, and lower loss. However, the emergence of partial… read more here.
Keywords: sic power; power modules; square wave; power ... See more keywords
Improvement of Silver-Sintered Die Bonding of SiC/DBC Power Modules Through Backside Metallization With High-Density (111) Orientation Ag Nanotwinned Films
Sign Up to like & getrecommendations! Published in 2024 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2024.3380621
Abstract: Silver paste sintering is a promising die attachment technology for power electronic devices due to its high thermal and electrical conductivities, as well as superior mechanical properties. This study presents the silver-sintered die bonding of… read more here.
Keywords: die bonding; power modules; silver sintered; sintered die ... See more keywords
Thermomechanical Stress Analysis, Characterization, and Optimization for Double-Side Cooled Power Modules With Ceramic Substrate
Sign Up to like & getrecommendations! Published in 2024 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2024.3381471
Abstract: Benefiting from the high thermal performance and low parasitic parameters, double-side cooled (DSC) power modules are promising in high-power-density applications. However, as the structure of DSC power module differs from that of conventional power module,… read more here.
Keywords: dsc power; power modules; ceramic substrate; power module ... See more keywords
Review of Double Sided Cooling Power Modules for Driving Electric Vehicles
Sign Up to like & getrecommendations! Published in 2023 at "IEEE Transactions on Device and Materials Reliability"
DOI: 10.1109/tdmr.2023.3272928
Abstract: Power module packaging technologies are undergoing extensive changes to satisfy compact high-power-density systems. The advantages of double-sided cooling power module in thermal and electrical compared to wire-bonding are summarized. Some typical double-sided cooling power modules… read more here.
Keywords: sided cooling; cooling power; power; review double ... See more keywords
Cause Analysis on the Abnormal Failure of SiC Power Modules During the HV-H3TRB Tests
Sign Up to like & getrecommendations! Published in 2024 at "IEEE Transactions on Device and Materials Reliability"
DOI: 10.1109/tdmr.2024.3379498
Abstract: The SiC die has broad application prospects in new energy vehicles due to its excellent performances. In recent years, with the continuous development, the safety and reliability of SiC power modules have become particularly important… read more here.
Keywords: failure sic; sic power; power modules; abnormal failure ... See more keywords
An Online Unified Delay and Slew Rate Regulation for Current Sharing in Paralleled SiC Power Modules With Active Gate Drivers
Sign Up to like & getrecommendations! Published in 2025 at "IEEE Transactions on Industrial Electronics"
DOI: 10.1109/tie.2024.3443969
Abstract: To ensure balanced current sharing between paralleled power modules, active gate drivers (AGDs) can be used to adjust the currents dynamically. However, achieving effective, flexible and accurate dynamic current adjustment is a challenge for AGDs… read more here.
Keywords: rate regulation; power modules; regulation; slew rate ... See more keywords
Analysis of Acoustic Emission Signals From SiC MOSFETs Using Robust Local Mean Decomposition and Generalized S-Transform
Sign Up to like & getrecommendations! Published in 2025 at "IEEE Transactions on Instrumentation and Measurement"
DOI: 10.1109/tim.2025.3544364
Abstract: Power modules are the most vulnerable components in power electronic systems. It is essential to conduct fault diagnosis and implement protections on power modules to prevent further damage to the system. Existing methods primarily identify… read more here.
Keywords: power modules; sic mosfets; acoustic emission; local mean ... See more keywords
Common-Mode EMI Noise Analysis and Reduction for AC–DC–AC Systems With Paralleled Power Modules
Sign Up to like & getrecommendations! Published in 2020 at "IEEE Transactions on Power Electronics"
DOI: 10.1109/tpel.2019.2957358
Abstract: In this article, the common-mode (CM) noise model is developed for an ac–dc–ac system with paralleled power modules. The CM noise contributions from both rectifiers and motor drives are analyzed. The interaction between the ac/dc… read more here.
Keywords: reduction; power modules; common mode; paralleled power ... See more keywords
Localization and Detection of Bond Wire Faults in Multichip IGBT Power Modules
Sign Up to like & getrecommendations! Published in 2020 at "IEEE Transactions on Power Electronics"
DOI: 10.1109/tpel.2020.2965019
Abstract: Multichip insulated gate bipolar transistor (mIGBT) power modules (PMs) degrade over power cycling. Bond wire lift–off is one of the major failure modes. This article presents a technique to diagnose bond wire lift-off by analyzing… read more here.
Keywords: lift; bond; power modules; bond wire ... See more keywords