Sign Up to like & get
recommendations!
0
Published in 2018 at "Ceramics International"
DOI: 10.1016/j.ceramint.2017.11.140
Abstract: Abstract This paper presents the research achievement in Japan to develop highly-refractive electro-ceramics for application to silicon carbide (SiC) power modules such as heat-resistive passive components (snubber capacitors and resistors), metalised substrates, ceramic circuit boards,…
read more here.
Keywords:
temperature;
power modules;
electro ceramics;
sic power ... See more keywords
Sign Up to like & get
recommendations!
0
Published in 2019 at "Microelectronics Reliability"
DOI: 10.1016/j.microrel.2019.113500
Abstract: Abstract Current environmental concerns and fuel scarcity are leading to the progressive introduction of Electric Vehicles (EV) in the global fleet vehicle population. This requires significant design and research efforts from scientific community and industry…
read more here.
Keywords:
methodology;
power;
power modules;
reliability ... See more keywords
Sign Up to like & get
recommendations!
1
Published in 2023 at "IEEE Transactions on Device and Materials Reliability"
DOI: 10.1109/tdmr.2023.3272928
Abstract: Power module packaging technologies are undergoing extensive changes to satisfy compact high-power-density systems. The advantages of double-sided cooling power module in thermal and electrical compared to wire-bonding are summarized. Some typical double-sided cooling power modules…
read more here.
Keywords:
sided cooling;
cooling power;
power;
review double ... See more keywords
Sign Up to like & get
recommendations!
1
Published in 2020 at "IEEE Transactions on Power Electronics"
DOI: 10.1109/tpel.2019.2957358
Abstract: In this article, the common-mode (CM) noise model is developed for an ac–dc–ac system with paralleled power modules. The CM noise contributions from both rectifiers and motor drives are analyzed. The interaction between the ac/dc…
read more here.
Keywords:
reduction;
power modules;
common mode;
paralleled power ... See more keywords
Sign Up to like & get
recommendations!
1
Published in 2020 at "IEEE Transactions on Power Electronics"
DOI: 10.1109/tpel.2020.2965019
Abstract: Multichip insulated gate bipolar transistor (mIGBT) power modules (PMs) degrade over power cycling. Bond wire lift–off is one of the major failure modes. This article presents a technique to diagnose bond wire lift-off by analyzing…
read more here.
Keywords:
lift;
bond;
power modules;
bond wire ... See more keywords
Sign Up to like & get
recommendations!
0
Published in 2021 at "IEEE Transactions on Power Electronics"
DOI: 10.1109/tpel.2020.3015226
Abstract: As high voltage, wide-band-gap power modules increase in power density with high switching frequency, they create localized hot spots and harmful electromagnetic interference (EMI). If not treated properly, these issues can drastically reduce the reliability…
read more here.
Keywords:
power modules;
performance;
high voltage;
thermal electrical ... See more keywords
Sign Up to like & get
recommendations!
1
Published in 2022 at "Materials"
DOI: 10.3390/ma15031036
Abstract: Ceramic baseplates are important elements in the power modules of electric drives. This paper presents low-temperature cofired ceramic (LTCC) and high-temperature cofired ceramic (HTCC) materials for the fabrication of three-dimensional power modules. The silver-based metallization…
read more here.
Keywords:
material selection;
power;
metallization material;
wire ... See more keywords