Review on the Thermal Models Applications in the Reliability of Power Semiconductor Device
Sign Up to like & getrecommendations! Published in 2025 at "IET Power Electronics"
DOI: 10.1049/pel2.70065
Abstract: The power semiconductor device plays a key role in energy conversion and management, and the failure of the device would make a great economic loss. To improve the reliability of the device, many methods have… read more here.
Keywords: power semiconductor; semiconductor device; reliability; thermal models ... See more keywords
Experimental Assessment on the Use of Power Semiconductor Filtering Technique in Grid-Connected Inverter
Sign Up to like & getrecommendations! Published in 2024 at "IEEE Access"
DOI: 10.1109/access.2024.3417237
Abstract: An experimental assessment on the use of power semiconductor filtering technique in grid-connected inverter is presented. The idea is based on introducing a series pass device (SPD) between the point of common coupling (PCC) and… read more here.
Keywords: power semiconductor; spd; experimental assessment; use power ... See more keywords
Exploiting Distinct Thermal Response Properties for Power Semiconductor Module Health Monitoring
Sign Up to like & getrecommendations! Published in 2021 at "IEEE Journal of Emerging and Selected Topics in Power Electronics"
DOI: 10.1109/jestpe.2020.3022775
Abstract: This article develops the techniques for actively tracking response shifts, induced by thermal–mechanical degradation over components lifetimes’, in spatiotemporal thermal response dynamics. The methodology considers both boundary (e.g., cooling) and internal (e.g., voiding) sources of… read more here.
Keywords: power semiconductor; degradation; thermal response; response ... See more keywords
Wide-Bandgap Power Semiconductors for Electric Vehicle Systems: Challenges and Trends
Sign Up to like & getrecommendations! Published in 2021 at "IEEE Vehicular Technology Magazine"
DOI: 10.1109/mvt.2021.3112943
Abstract: In recent years, researchers have been attracted to the application of wide-bandgap (WBG) power semiconductor devices such as silicon carbide (SiC) and gallium nitride (GaN) in electric vehicle (EV) applications. Their advantages over Si power… read more here.
Keywords: semiconductor devices; wbg power; power semiconductor; electric vehicle ... See more keywords
Thermal Performance Improvement in Multi-Megawatt Power Converters Serving to Asynchronous Hydro Generators Operating Around Synchronous Speed
Sign Up to like & getrecommendations! Published in 2021 at "IEEE Transactions on Energy Conversion"
DOI: 10.1109/tec.2020.3037244
Abstract: In multi-MW three-level neutral point clamped back-to-back (3L-NPC) power converters, power semiconductor devices are considered as most vulnerable components due to its thermo-mechanical fatigue stress. Particularly, rotor side converter (RSC) in doubly fed induction machine… read more here.
Keywords: around synchronous; power converters; active thermal; power ... See more keywords
Solid-State Relay Solutions for Induction Cooking Applications Based on Advanced Power Semiconductor Devices
Sign Up to like & getrecommendations! Published in 2019 at "IEEE Transactions on Industrial Electronics"
DOI: 10.1109/tie.2018.2838093
Abstract: This paper focuses on providing an improved and efficient alternative to electromechanical relays (EMRs) in view of the growing demand characteristics for an effective power multiplexing in induction heating applications. A major analytical approach to… read more here.
Keywords: state relay; power; power semiconductor; induction ... See more keywords
A Method for Separation of Power Semiconductor Packaging-Related Wear-Out Mechanisms Under Converter Operation
Sign Up to like & getrecommendations! Published in 2024 at "IEEE Transactions on Industrial Electronics"
DOI: 10.1109/tie.2023.3273269
Abstract: This article proposes a new method to separate the package-related wear-out failure mechanisms of wire-bonded silicon-based power semiconductor switches: bond-wires lift-off and solder layer degradation. The proposed method takes the on-state voltages of power semiconductor… read more here.
Keywords: method; power semiconductor; separation; related wear ... See more keywords
Coordinated PWM-Based Active Thermal Control for Power Semiconductor Devices in Parallel Grid-Tied Inverters
Sign Up to like & getrecommendations! Published in 2024 at "IEEE Transactions on Power Electronics"
DOI: 10.1109/tpel.2024.3452722
Abstract: This article proposes a new active thermal control method for power semiconductor devices in parallel grid-tied inverters using coordinated pulsewidth modulation (PWM), which breaks the limitation that the PWM-based active thermal control cannot reduce the… read more here.
Keywords: power semiconductor; thermal control; semiconductor devices; power ... See more keywords
Power Cycling Testing for Power Semiconductor Switches: Methods, Standards, Limitations, and Outlooks
Sign Up to like & getrecommendations! Published in 2026 at "IEEE Transactions on Power Electronics"
DOI: 10.1109/tpel.2025.3595180
Abstract: Reliability is a critical performance metric for power semiconductor switches and power electronic systems. Yet guidance on how to test and quantify that reliability is fragmented in the existing literature, particularly with the rapid adoption… read more here.
Keywords: cycling testing; semiconductor switches; power semiconductor; power cycling ... See more keywords
Multipoint Thermal Sensing System for Power Semiconductor Devices Utilizing Fiber Bragg Gratings
Sign Up to like & getrecommendations! Published in 2024 at "Applied Sciences"
DOI: 10.3390/app142311328
Abstract: This study investigates the feasibility of using fiber Bragg grating (FBG) sensors for multipoint thermal monitoring of several power semiconductor devices (PSDs), such as insulated gate bipolar transistors (IGBTs), and rectifiers assembled on a common… read more here.
Keywords: power semiconductor; multipoint thermal; fbg sensors; semiconductor devices ... See more keywords
Highly Robust, Pressureless Silver Sinter-Bonding Technology Using PMMA Combustion for Power Semiconductor Applications
Sign Up to like & getrecommendations! Published in 2024 at "Materials"
DOI: 10.3390/ma17215142
Abstract: This study presents the development of a highly robust, pressureless, and void-free silver sinter-bonding technology for power semiconductor packaging. A bimodal silver paste containing silver nanoparticles and sub-micron particles was used, with polymethyl methacrylate (PMMA)… read more here.
Keywords: technology; pressureless; power semiconductor; silver ... See more keywords