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Published in 2021 at "IEEE Journal of Emerging and Selected Topics in Power Electronics"
DOI: 10.1109/jestpe.2020.3022775
Abstract: This article develops the techniques for actively tracking response shifts, induced by thermal–mechanical degradation over components lifetimes’, in spatiotemporal thermal response dynamics. The methodology considers both boundary (e.g., cooling) and internal (e.g., voiding) sources of…
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Keywords:
power semiconductor;
degradation;
thermal response;
response ... See more keywords
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Published in 2021 at "IEEE Vehicular Technology Magazine"
DOI: 10.1109/mvt.2021.3112943
Abstract: In recent years, researchers have been attracted to the application of wide-bandgap (WBG) power semiconductor devices such as silicon carbide (SiC) and gallium nitride (GaN) in electric vehicle (EV) applications. Their advantages over Si power…
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Keywords:
semiconductor devices;
wbg power;
power semiconductor;
electric vehicle ... See more keywords
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Published in 2021 at "IEEE Transactions on Energy Conversion"
DOI: 10.1109/tec.2020.3037244
Abstract: In multi-MW three-level neutral point clamped back-to-back (3L-NPC) power converters, power semiconductor devices are considered as most vulnerable components due to its thermo-mechanical fatigue stress. Particularly, rotor side converter (RSC) in doubly fed induction machine…
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Keywords:
around synchronous;
power converters;
active thermal;
power ... See more keywords
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Published in 2019 at "IEEE Transactions on Industrial Electronics"
DOI: 10.1109/tie.2018.2838093
Abstract: This paper focuses on providing an improved and efficient alternative to electromechanical relays (EMRs) in view of the growing demand characteristics for an effective power multiplexing in induction heating applications. A major analytical approach to…
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Keywords:
state relay;
power;
power semiconductor;
induction ... See more keywords