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Practical analytical modeling of 3D multi-layer Printed Wired Board with buried volumetric heating sources

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0 Published in 2018 at "International Journal of Thermal Sciences"

DOI: 10.1016/j.ijthermalsci.2018.03.016

Abstract: Abstract Ceaseless efforts have been made by the electronic companies to increase the density of electronic boards. A new design concept consists of burying active and passive electronic components inside inner layers of a Printed… read more here.

Keywords: modeling multi; layer; practical analytical; multi layer ... See more keywords