Predicting delamination in multilayer composite circuit boards with bonded microelectronic components
Sign Up to like & getrecommendations! Published in 2017 at "Engineering Fracture Mechanics"
DOI: 10.1016/j.engfracmech.2017.11.026
Abstract: Abstract The present work developed a mixed-mode cohesive zone model (CZM) with a mode I failure criterion to predict the delamination bending loads of multilayer, composite printed circuit boards (PCBs) assembled with soldered ball grid… read more here.
Keywords: delamination; multilayer composite; circuit boards; pcb ... See more keywords