Thermal Management System for Press-Pack IGBT Based on Liquid Metal Coolant
Sign Up to like & getrecommendations! Published in 2020 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2020.3011043
Abstract: The press-pack packaging technology has been adopted in recent years for insulated-gate bipolar transistors (IGBTs) to be utilized in high voltage–high current applications, such as high-voltage direct current (HVdc) electric power transmission. Traditionally, the heat… read more here.
Keywords: system; press pack; liquid metal;
In Situ Contact Pressure Monitoring of Press Pack Power Module Using FBG Sensors
Sign Up to like & getrecommendations! Published in 2022 at "IEEE Transactions on Instrumentation and Measurement"
DOI: 10.1109/tim.2022.3193950
Abstract: For press pack power semiconductor modules, the contact pressure is a key parameter to monitor their operating condition and health status. Direct internal measurement using conventional sensors has been difficult due to the restricted space… read more here.
Keywords: pack power; fbg sensors; contact pressure; press pack ... See more keywords