An All-Silicon Resonant Pressure Microsensor Based on Eutectic Bonding
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DOI: 10.3390/mi14020441
Abstract: In this paper, an all-Si resonant pressure microsensor based on eutectic bonding was developed, which can eliminate thermal expansion coefficient mismatches and residual thermal stresses during the bonding process. More specifically, the resonant pressure microsensor… read more here.
Keywords: resonant pressure; microsensor; cap; eutectic bonding ... See more keywords