Effect of particle size distribution on the mechanical and electrical properties of reverse-offset printed Sn–Ag–Cu solder bumps
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DOI: 10.1007/s10854-018-0021-1
Abstract: A reduction of the particle size used in solder pastes was shown to affect the electrical and mechanical properties of finely printed solder bumps. Sn–3.0Ag–0.5Cu solder nanoparticles were synthesized using a radio frequency thermal plasma… read more here.
Keywords: particle size; printed solder; reverse offset; solder bumps ... See more keywords