Design of the printing pattern on film for three‐dimensional molded interconnect devices
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DOI: 10.1002/adv.21830
Abstract: This article discusses the application of an in-mold decoration (IMD) technology for the development of three-dimensional molded interconnect devices (3D-MID). The 3D-MID process uses the film printing technology to print the circuit pattern on a… read more here.
Keywords: three dimensional; printing pattern; molded interconnect; interconnect devices ... See more keywords