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Published in 2020 at "Materials today communications"
DOI: 10.1016/j.mtcomm.2020.100928
Abstract: Abstract The morphology evolution of Cu6Sn5 grains in (001)Cu/Sn/Cu and (011)Cu/Sn/Cu micro solder joints reflowing with and without a temperature gradient was studied. In the as-soldered state, regular and perpendicular prism-type Cu6Sn5 grains formed on…
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Keywords:
type cu6sn5;
type;
prism type;
cu6sn5 ... See more keywords