Efficient Approach to Failure Response of Process Module in Dual-Arm Cluster Tools With Wafer Residency Time Constraints
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DOI: 10.1109/tsmc.2019.2899590
Abstract: In semiconductor manufacturing, a process module (PM) failure in cluster tools (CTs) happens from time to time. To effectively operate a CT, such a failure should be handled in a proper and timely manner. This… read more here.
Keywords: time; response; process module; failure ... See more keywords