Sign Up to like & get
recommendations!
1
Published in 2017 at "Journal of Alloys and Compounds"
DOI: 10.1016/j.jallcom.2016.12.104
Abstract: Abstract A defect-free Sn-based metallization layer was prepared successfully on the surface of graphite at 950 °C for 30 min using Sn0.3Ag0.7Cu- 9%Cr (wt. %) metal powders. The typical interfacial microstructure of the metallization interface was β-Sn/Cr3C2/graphite.…
read more here.
Keywords:
graphite copper;
novel metallization;
process soldering;
metallization process ... See more keywords