Recent progress in SLID bonding in novel 3D-IC technologies
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DOI: 10.1016/j.jallcom.2019.152825
Abstract: Abstract Solid-liquid interdiffusion (SLID) bonding was extensively investigated as a potential bonding method applied to 3D chip stacking because it can be bonded at a low temperature and used in a high temperature. In this… read more here.
Keywords: novel technologies; bonding novel; progress slid; recent progress ... See more keywords