Thermal influence on the mechanical properties of cardboard during an ultrasonic-assisted embossing process
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DOI: 10.15376/biores.15.3.5110-5121
Abstract: During the embossing process, a fiber sandwich is compressed between embossing tools. The use of ultrasound causes a short-term increase in the material temperature in addition to causing plastic deformation. The combination of the material… read more here.
Keywords: embossing process; properties cardboard; mechanical properties; temperature ... See more keywords