Study on the relationship between Cu protrusion behavior and stresses evolution in the through-silicon via characterized by in-situ μ-Raman spectroscopy
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DOI: 10.1016/j.microrel.2020.113949
Abstract: Abstract Thermal cycling during annealing step can induce stresses and consequently lead to the Cu protrusion in through-silicon via (TSV) structures. However, the relationship between the thermal stress in Si and the consequent Cu protrusion… read more here.
Keywords: protrusion; silicon via; spectroscopy; relationship ... See more keywords