Fabrication of Micro-Punch Array by Plasma Printing for Micro-Embossing into Copper Substrates
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DOI: 10.3390/ma12162640
Abstract: Copper substrates were wrought to have micro-grooves for packaging by micro-stamping with use of a AISI316 stainless steel micro-punch array. The micro-texture of this arrayed punch was first tailored and compiled into CAD data. A… read more here.
Keywords: punch array; micro; copper substrates; micro embossing ... See more keywords