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Published in 2018 at "Optics Communications"
DOI: 10.1016/j.optcom.2018.04.033
Abstract: Abstract As a deep and fine vertical via, through-silicon via (TSV) is a key factor in three-dimensional (3D) integrated circuit stack, which can pass through a silicon wafer or chip for 3D integration. TSV’s 3D…
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Keywords:
high frequency;
pupil plane;
tsv;
silicon ... See more keywords
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1
Published in 2018 at "Monthly Notices of the Royal Astronomical Society"
DOI: 10.1093/mnras/sty926
Abstract: For the next generation of extremely large telescopes, Focal Anisoplanatism (FA) renders single Laser Guide Star AO useless. Here we analyze a novel LGS alternative configuration with corresponding wavefront sensing and reconstruction method, termed Projected…
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Keywords:
wavefront sensing;
laser;
plane pattern;
projected pupil ... See more keywords
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Published in 2018 at "Applied optics"
DOI: 10.1364/ao.57.005688
Abstract: A differential evolution algorithm (DEA) is shown to improve the design of phase-only pupil plane masks for imaging in the presence of a high-intensity point source. Strehl and suppression ratio metrics for various phase basis…
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Keywords:
phase;
phase masks;
optimized pupil;
pupil plane ... See more keywords