Development of n+-in-p planar pixel quadsensor flip-chipped with FE-I4 readout ASICs
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Instrumentation"
DOI: 10.1088/1748-0221/12/01/c01084
Abstract: We have developed flip-chip modules applicable to the pixel detector for the HL-LHC. New radiation-tolerant n+-in-p planar pixel sensors of a size of four FE-I4 application-specific integrated circuits (ASICs) are laid out in a 6-in… read more here.
Keywords: flip; bump bonding; quadsensor; pixel ... See more keywords