Interfacial Reactions Between Lead-Free Solders and Ni-Pd-Co Alloys
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DOI: 10.1007/s11837-019-03625-2
Abstract: The liquid/solid interfacial reactions of Sn, Sn-(3.0 wt.% to 0.5 wt.%)Cu (SAC), and Sn-9.0 wt.%Zn (SZ) solders with Ni-xPd-yCo substrates at 240°C, 270°C, and 300°C for 0.5 h to 5 h have been investigated. The… read more here.
Keywords: xpd yco; free solders; reactions lead; interfacial reactions ... See more keywords