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Published in 2020 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-020-02950-6
Abstract: The microelectronics packaging industry, although rapidly growing, faces several challenges including 3-D integration, issues with multifunctional capability, and fluctuating input/output (I/O) density, among others. Better-performing microelectronics assemblies for mitigating these challenges require alloys with superior…
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Keywords:
pure layers;
interfacial reactions;
pure;
pure joint ... See more keywords