Investigation of Various Bumps and Redistribution Lines to Inhibit Protected Silicon Nitride Cracks in High Pattern Density Chip Package
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DOI: 10.1007/s11664-020-08310-8
Abstract: Mechanical stress related to chip packaging failure is the most common reliability issue in semiconductor devices, especially for high pattern density of very-large-scale integration. In this paper, redistribution lines (RDL) corresponding to gold and copper… read more here.
Keywords: redistribution lines; high pattern; chip package; pattern density ... See more keywords