A New Approach for the Control and Reduction of Warpage and Residual Stresses in Bonded Wafer
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DOI: 10.3390/mi12040361
Abstract: A geometrical modification on silicon wafers before the bonding process, aimed to decrease (1) the residual stress caused by glass frit bonding, is proposed. Finite element modeling showed that (2) by introducing this modification, the… read more here.
Keywords: warpage residual; reduction warpage; new approach; warpage ... See more keywords