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Published in 2017 at "Archives of Civil and Mechanical Engineering"
DOI: 10.1016/j.acme.2017.03.010
Abstract: Abstract Grinding process of monocrystalline silicon easily leads to fractured surfaces, therefore an analytical model of the ground silicon surface is presented. In the model, the ductile-regime effect is considered by determining grain-workpiece interaction mode…
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Keywords:
topography;
monocrystalline silicon;
ductile regime;
regime effect ... See more keywords