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Published in 2019 at "Nanomaterials"
DOI: 10.3390/nano9101478
Abstract: In this study, the effects of adding Sn nanopowder (particle size < 150 nm) to three solder pastes SAC3-X(H)F3+, SCAN-Ge071-XF3+, and water washable WW50-SAC3 are evaluated regarding microstructure, morphology, joint strength, and electrical resistance. The…
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Keywords:
joint strength;
solder paste;
reinforced solder;
paste ... See more keywords