A Method for Separation of Power Semiconductor Packaging-Related Wear-Out Mechanisms Under Converter Operation
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DOI: 10.1109/tie.2023.3273269
Abstract: This article proposes a new method to separate the package-related wear-out failure mechanisms of wire-bonded silicon-based power semiconductor switches: bond-wires lift-off and solder layer degradation. The proposed method takes the on-state voltages of power semiconductor… read more here.
Keywords: method; power semiconductor; separation; related wear ... See more keywords