A Novel Approach for Reliability Investigation of LEDs on Molded Interconnect Devices Based on FE-Analysis Coupled to Injection Molding Simulation
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DOI: 10.1109/access.2019.2913786
Abstract: Due to many advantages, such as cost-effective production, design freedom, and weight reduction, plastics have replaced metals and ceramics in many fields. However, engineering plastics are good thermal insulators. This characteristic, although beneficial in certain… read more here.
Keywords: reliability investigation; novel approach; approach reliability; simulation ... See more keywords