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Published in 2017 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2017.2729586
Abstract: Previously, we reported the introduction of the low-temperature, pressure-less Ag direct bonding method, which has a high bond strength. In spite of this, when Ag was deposited directly on the sapphire surface of a GaN-based…
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Keywords:
reliable highly;
highly reliable;
sapphire;
sapphire surface ... See more keywords