Effect of W content in Co-W-P metallization on both oxidation resistance and resin adhesion
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DOI: 10.1007/s10853-019-04028-z
Abstract: The application of Co-W-P plating technology in high-temperature package structure is advantageous from a point of structural reliability because Co-W-P metallization is known to deliver strong bonding to both high-temperature-compatible Ag-sintered joining and high-temperature-compatible encapsulation… read more here.
Keywords: oxidation resistance; adhesion; resin adhesion; metallization ... See more keywords