High Heat Resistance and Low Dielectric o‐Cresol Formaldehyde Epoxy Resin Solder Resist Containing Photocurable Small Molecular Compound Based on 3,4‐Epoxycyclohexylmethyl Methacrylate
Sign Up to like & getrecommendations! Published in 2025 at "Journal of Applied Polymer Science"
DOI: 10.1002/app.56802
Abstract: High heat resistance and low dielectric constant are the development trend for PCB ink. Generally, higher crosslinking density and rigid molecular structure are beneficial for improving the heat resistance, and low polarity molecules and larger… read more here.
Keywords: heat resistance; high heat; resin; resistance low ... See more keywords
Fabrication of porous polyketone forward osmosis membranes modified with aromatic compounds: Improved pressure resistance and low structural parameter
Sign Up to like & getrecommendations! Published in 2020 at "Separation and Purification Technology"
DOI: 10.1016/j.seppur.2020.117400
Abstract: Abstract In this study, we fabricated porous polyketone (PK) support membranes with high pressure resistance and low structural parameter (S) by surface modification with aromatic compounds for osmotically driven membrane process applications. The effects of… read more here.
Keywords: resistance low; aromatic compounds; porous polyketone; pressure resistance ... See more keywords
Computation of the Electrical Resistance of a Low Current Multi-Spot Contact
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DOI: 10.3390/ma15062056
Abstract: In high complexity electrical systems such as those used in the automotive industries, electric connectors play an important role. The automotive industry is gradually shifting its attention to electric cars, which means more electrical connectors… read more here.
Keywords: computation electrical; contact; electrical resistance; resistance low ... See more keywords