Tunable Reverse Offset Printing with a Stretchable Blanket for Fabricating Flexible Printed Electronics
Sign Up to like & getrecommendations! Published in 2021 at "Advanced Engineering Materials"
DOI: 10.1002/adem.202001537
Abstract: Reverse offset printing (ROP) is receiving increasing attention as an emerging technology for printed electronics due to its rapid, environment‐friendly fabrication processes. A tunable ROP process is proposed by exploiting the controlled elastic deformation of… read more here.
Keywords: reverse offset; stretchable blanket; printed electronics; blanket ... See more keywords
Effect of particle size distribution on the mechanical and electrical properties of reverse-offset printed Sn–Ag–Cu solder bumps
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-018-0021-1
Abstract: A reduction of the particle size used in solder pastes was shown to affect the electrical and mechanical properties of finely printed solder bumps. Sn–3.0Ag–0.5Cu solder nanoparticles were synthesized using a radio frequency thermal plasma… read more here.
Keywords: particle size; printed solder; reverse offset; solder bumps ... See more keywords