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Published in 2023 at "IEEE Transactions on Device and Materials Reliability"
DOI: 10.1109/tdmr.2023.3272928
Abstract: Power module packaging technologies are undergoing extensive changes to satisfy compact high-power-density systems. The advantages of double-sided cooling power module in thermal and electrical compared to wire-bonding are summarized. Some typical double-sided cooling power modules…
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Keywords:
sided cooling;
cooling power;
power;
review double ... See more keywords