A review of silicon-based wafer bonding processes, an approach to realize the monolithic integration of Si-CMOS and III–V-on-Si wafers
Sign Up to like & getrecommendations! Published in 2021 at "Journal of Semiconductors"
DOI: 10.1088/1674-4926/42/2/023106
Abstract: The heterogeneous integration of III–V devices with Si-CMOS on a common Si platform has shown great promise in the new generations of electrical and optical systems for novel applications, such as HEMT or LED with… read more here.
Keywords: iii; integration; review silicon; wafer bonding ... See more keywords
Review of 2 × 2 Silicon Photonic Switches
Sign Up to like & getrecommendations! Published in 2023 at "Photonics"
DOI: 10.3390/photonics10050564
Abstract: With the advent of 5G, artificial intelligence (AI), Internet of Things (IoT), cloud computing, Internet plus, and so on, data traffic is exploding and higher requirements are put forward for information transmission and switching. Traditional… read more here.
Keywords: switching; silicon photonic; review silicon; photonic switches ... See more keywords