Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints
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DOI: 10.3390/ma15145086
Abstract: Sn-rich solder joints in three-dimensional integrated circuits and their reliability issues, such as the electromigration (EM), thermomigration (TM), and thermomechanical fatigue (TMF), have drawn attention related to their use in electronic packaging. The Sn grain… read more here.
Keywords: grain orientation; solder joints; rich solder; solder ... See more keywords