A Robust Integrated Power Delivery Methodology for 3-D ICs
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DOI: 10.1109/tvlsi.2022.3214793
Abstract: The inherent advantages of three-dimensional (3-D) integrated circuits (ICs) are well-aligned with the continuous demand for increased density of functionality, reduced latency, the power dissipation of communication, and heterogeneity of modern applications. Delivering power efficiently… read more here.
Keywords: integrated power; methodology; power; robust integrated ... See more keywords