Rowhammer Vulnerability of DRAMs in 3-D Integration
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DOI: 10.1109/tvlsi.2024.3368044
Abstract: We investigate the vulnerability of 3-D-integrated dynamic random access memorys (DRAMs) [i.e., typically connected with silicon via (TSV), monolithic interconnect via (MIV)] to Rowhammer attacks. We have developed a SPICE framework to characterize Rowhammer attacks… read more here.
Keywords: integration; rowhammer vulnerability; rowhammer attacks; vulnerability drams ... See more keywords