The Impacts of Material Uncertainty in Electro-Migration of SAC Solder Electronic Packaging by Monte Carlo-Based Stochastic Finite-Element Model
Sign Up to like & getrecommendations! Published in 2021 at "IEEE Transactions on Components, Packaging and Manufacturing Technology"
DOI: 10.1109/tcpmt.2021.3110969
Abstract: Electro-migration (EM) induced by electric current under the conditions of multi-physical fields in integrated circuits and electronic packaging is a crucial factor that affects reliability and safety of the entire system. The uncertainty quantification and… read more here.
Keywords: finite element; based stochastic; sac solder; model ... See more keywords
Analysis and Modeling of Aged SAC-Bi Solder Joints Subjected to Varying Stress Cycling Conditions
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DOI: 10.3390/ma16020750
Abstract: Solder joints are subjected to varied stress cycle circumstances in the electronic packaging service life but are also influenced by aging. There has been limited investigation into the influence of aging and varying cycles on… read more here.
Keywords: sac solder; stress; solder; solder joints ... See more keywords