Influence of additives on electroplated copper films and shear strength of SAC305/Cu solder joints
Sign Up to like & getrecommendations! Published in 2019 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-019-02764-1
Abstract: An accelerator, 3-(2-benzothiazolylthio)-1-propanesulfonsäure (ZPS), and a suppressor, polyethylene glycol (PEG), were employed and formulated with chloride ions (Cl − ) in plating solution containing electrolytes (CuSO 4 and H 2 SO 4 ) to prepare… read more here.
Keywords: microscopy; solder joints; zps; electron ... See more keywords