Articles with "sac305 solder" as a keyword



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Influence of additives on electroplated copper films and shear strength of SAC305/Cu solder joints

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Published in 2019 at "Journal of Materials Science: Materials in Electronics"

DOI: 10.1007/s10854-019-02764-1

Abstract: An accelerator, 3-(2-benzothiazolylthio)-1-propanesulfonsäure (ZPS), and a suppressor, polyethylene glycol (PEG), were employed and formulated with chloride ions (Cl − ) in plating solution containing electrolytes (CuSO 4 and H 2 SO 4 ) to prepare… read more here.

Keywords: microscopy; solder joints; zps; electron ... See more keywords