Surface integrity and removal mechanism in grinding sapphire wafers with novel vitrified bond diamond plates
Sign Up to like & getrecommendations! Published in 2017 at "Materials and Manufacturing Processes"
DOI: 10.1080/10426914.2016.1140194
Abstract: ABSTRACT In order to improve machining efficiency of sapphire wafer machining using the conventional loose abrasive process, fixed-abrasive diamond plates are investigated in this study for sapphire wafer grinding. Four vitrified bond diamond plates of… read more here.
Keywords: diamond plates; removal; surface; sapphire wafers ... See more keywords
Machine Learning-Based Wheel Monitoring for Sapphire Wafers
Sign Up to like & getrecommendations! Published in 2021 at "IEEE Access"
DOI: 10.1109/access.2021.3067329
Abstract: The thinning of sapphire wafers is a key process that affects the quality of optoelectronic devices. In the grinding process for sapphire, a hard and brittle material, the grade and surface conditions (wearing and chip… read more here.
Keywords: wheel monitoring; sapphire wafers; wheel; grinding process ... See more keywords