Investigation on residual scratch depth and material removal rate of scratching machining single crystal silicon with Berkovich indenter
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DOI: 10.1016/j.mssp.2019.04.037
Abstract: Abstract Single crystal silicon is the basic material for the fabrication of micro-devices and micro-structures. It exhibits plastic behavior in micro/nano-machining. The key to obtain high-quality machined surfaces in ultra-precision machining of brittle materials is… read more here.
Keywords: scratching machining; single crystal; crystal silicon; material removal ... See more keywords