Foreword: Special Section on Packaging and Interconnects: Cutting-Edge Solutions in Modeling, Design, and Characterization—Part I
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DOI: 10.1109/tcpmt.2019.2936963
Abstract: In a world of digitally native citizens, processors and memory are common topics of conversation, no longer restricted to the engineering community. It is only natural. After all, one does not need to be an… read more here.
Keywords: special section; section packaging; foreword special; characterization ... See more keywords