Surface Self-nanocrystallization in Copper Electroforming
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DOI: 10.1007/s11665-018-3793-9
Abstract: The coarse columnar grain layer generated on top of electroforming deposits leads to low surface strength and poor global performance of deposits. Here, we introduce a particle abrasive-induced surface self-nanocrystallization process, which is a part… read more here.
Keywords: copper deposits; surface; self nanocrystallization; copper ... See more keywords