Stabilization of the thermal decomposition process of self-reducible copper ion ink for direct printed conductive patterns
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DOI: 10.1039/c7ra01005b
Abstract: In this study, a thermally triggered self-reducible copper ink is developed to print conductive patterns on flexible substrates. Inks containing only copper formate (CuF) and monoisopropanol amine (MIPA) generated large bubbles in the CuF decomposing… read more here.
Keywords: conductive patterns; ink; reducible copper; copper ... See more keywords