Artificial intelligent matching for scratches of semiconductor wafers based on a K-NN algorithm
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DOI: 10.1088/2051-672x/ab1ca3
Abstract: Scratches, those usually generated during polishing the silicon wafer surface, are one of the major yield loss factors in semiconductor manufacturing industry. In order to determine the source of the scratches in real time and… read more here.
Keywords: matching scratches; main lines; intelligent matching; semiconductor wafers ... See more keywords