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Published in 2019 at "ECS Journal of Solid State Science and Technology"
DOI: 10.1149/2.0071908jss
Abstract: As CMOS scaling proceeds with sub-10 nm nodes, new architectures and materials are implemented to continue increasing performances at constant footprint. Strained and stacked channels and 3D-integrated devices have for instance been introduced for this…
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Keywords:
temperature;
group semiconductors;
low temperature;
semiconductors use ... See more keywords