An Advanced 2.5-D Heterogeneous Integration Packaging for High-Density Neural Sensing Microsystem
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DOI: 10.1109/ted.2017.2660763
Abstract: In the traditional neural sensing microstructure, the limited metal line pitch and the metal layer numbers restrict the neural signal routing ability from electrodes to circuit chips. Miniature packaging and excessive noise interference bottlenecks are… read more here.
Keywords: neural sensing; sensing microsystem; heterogeneous integration; packaging ... See more keywords